Copper Tungsten Thermal Properties

Engineering thermal properties of metals conductivity thermal expansion specific heat data metals in general have high electrical conductivity high thermal conductivity and high density.

Copper tungsten thermal properties.

Copper tungsten or wcu alloy also known as trade names elkonite is a composite matrix of tungsten and copper which combines the excellent properties of the elements such as heat resistance ablation resistance low thermal expansion and excellent thermal and electrical conductivity. Tungsten copper heat sinks they are composites of tungsten and copper. Typically they are malleable and ductile deforming under stress without cleaving. Copper infiltrated tungsten boasts such properties as high resistance to high temperature and arc erosion excellent thermal and electrical conductivity and a low cte coefficient of thermal.

Table 4 and fig. Tungsten copper alloy is also called copper tungsten alloy consists of w and cu owns properties of heat resistant high density low thermal expansivity and high electrical conductivity which has been widely used as electrode contacts and heat sink materials. The physical and mechanical properties and melting point of tungsten copper material will be positively or oppositely affected by varying the amount of. Tungsten copper combines many typical characteristics of the single elements tungsten and copper as for example the hardness wear and burn off resistance of tungs ten together with the good electrical and thermal conductivity of copper.

Contents of tungsten respectively copper can be selected. A high level of temperature resistance is one of the most important advantages of tungsten while the copper content increases the electrical and thermal conductivity. Tungsten copper has unique material properties. The high thermal conductivity of copper together with the low thermal expansion of tungsten allows thermal expansion matching to silicon gallium arsenide and some ceramics.

Very good thermal conductivity. The cuw75 composite with 75 tungsten is widely used in chip carriers substrates flanges and frames for power semiconductor devices. Consisting of pure tungsten w powder suspended in a matrix of copper cu these alloys are readily machinable and known for good thermal and electrical conductivity low thermal expansion being non magnetic good performance under vacuum and resistance to erosion from arcing.